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AI Disclosures
ISSU
DAISHIN SECURITIES
★
ELB 1086th Series: Actual Issuance of 2 Billion Won Due to Under-Subscription
 05/16/2026, 07:51 PM
ISSU
DAISHIN SECURITIES
★
Issuance of 350 Billion Won KOSPI200-Linked ELB (Annual 3.4-3.7%)
 05/16/2026, 07:51 PM
ISSU
DAISHIN SECURITIES
★
KRW 200 Billion 181-Day Equity-Linked Derivative Bond Issuance, 3.10%-3.11% Yield at Maturity
 05/16/2026, 07:51 PM
ISSU
DAISHIN SECURITIES
★
Issuance of 20 Billion Won Samsung Electronics-Linked Derivative Bond with 3.1% Annual Yield
 05/16/2026, 07:51 PM
ISSU
DAISHIN SECURITIES
★
Issuance of 99.85 Billion Won Samsung ELS with Up to 3.2% Annual Return
 05/16/2026, 07:51 PM
ISSU
DAISHIN SECURITIES
★
Additional Issuance of Two Low-Risk Samsung Electronics-Linked ELBs Totaling KRW 99.85 Billion
 05/16/2026, 07:51 PM
ISSU
DAISHIN SECURITIES
★
Daishin Securities Corrective Filing for Derivative-Linked Bonds (Reference Update & CEO Change)
 05/15/2026, 09:46 AM
ISSU
DAISHIN SECURITIES
★
Daishin Securities Revises Registration Statement for Derivative Bonds – Reflects Q1 Report and CEO Change
 05/15/2026, 09:45 AM
ISSU
DAISHIN SECURITIES
★
Amendment to Shelf Registration for Derivative-Linked Securities (CEO Change, Report Update)
 05/15/2026, 09:45 AM
ISSU
DAISHIN SECURITIES
★
Correction of Shelf Registration for ELS (Daishin Securities, CEO Change and Reference Update)
 05/15/2026, 09:45 AM
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