KRW 200 Billion 181-Day Equity-Linked Derivative Bond Issuance, 3.10%-3.11% Yield at Maturity

DAISHIN SECURITIES issues the 1087th Equity-Linked Derivative Bond (low-risk) linked to Samsung Electronics common stock, total amount KRW 19.98 billion, issue price KRW 9,990 per security, face value KRW 10,000, 2 million units.
Maturity 181 days (2026.11.05), pays 3.110% p.a. if final price >=300% of initial, otherwise 3.100% p.a. (principal-guaranteed structure).
Subscription period: 2026.05.08 only, minimum KRW 1 million, non-listed security; early redemption at 95%+ of fair value (90%+ within 6 months) but may incur principal loss.
Issuer credit rating AA- (Korea Ratings 2025.05.23, NICE Ratings 2025.06.10, Korea Corporate Rating 2026.04.13), not covered by depositor protection, issuance cancellation if total subscriptions < KRW 1 billion.
Underlying (Samsung Electronics) volatility 61.93%; historical simulation of 5,134 cases shows 99.98% probability of achieving 3.10% p.a. yield.

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