Issuance of 20 Billion Won Samsung Electronics-Linked Derivative Bond with 3.1% Annual Yield
- DAISHIN SECURITIES decided to issue the 1087th Equity-Linked Derivative Bond (low risk) worth 19.98 billion won (20,000,000 shares, face value 10,000 won per share, issue price 9,990 won)
- Underlying asset: Samsung Electronics common stock; maturity: November 5, 2026 (181 days); unlisted; cash settlement
- Maturity yield: 3.11% per annum if the underlying settlement price is 300% or more of the initial price, otherwise 3.10% per annum (99.98% probability based on simulation)
- Subscription period: May 8, 2026; minimum subscription amount: 1 million won; issuance may be canceled if total subscription is less than 1 billion won
- Issuer credit rating: AA- (Korea Ratings, NICE Ratings, Korea Corporate Rating); not covered by deposit insurance
- Proceeds will be used for hedging transactions; issuance expenses: 999,000 won; net proceeds: 19.79 billion won
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KOSPI Filing Information
- Filing: Shelf Registration Supplementary Document (Derivative-Linked Bonds - Equity-Linked Derivative-Linked Bonds)
- Company: DAISHIN SECURITIES (003540)
- Submission: DAISHIN SECURITIES CO.,LTD
- Receipt: 04-29-2026