Additional Issuance of Two Low-Risk Samsung Electronics-Linked ELBs Totaling KRW 99.85 Billion
- DAISHIN SECURITIES is issuing two additional equity-linked bonds (ELB), Series 1090 (KRW 49.95 billion, 184 days) and Series 1091 (KRW 49.9 billion, 366 days), under its remaining KRW 17.02 trillion shelf registration limit out of the total KRW 20 trillion planned for 2026.
- Series 1090 ELB is linked to Samsung Electronics common stock, paying 3.10% p.a. if the final valuation price is 500% or less of the initial strike, or 3.09% p.a. otherwise. Issue price KRW 9,990, 5 million units.
- Series 1091 ELB, also linked to Samsung Electronics common stock, pays 3.20% p.a. (≤500%) or 3.19% p.a. (>500%). Issue price KRW 9,980, 5 million units.
- Both securities are unlisted, not protected by the Deposit Insurance Act, and carry potential principal loss. Subscription is open on May 13, 2026, exclusively for Hana Bank trust customers.
- DAISHIN SECURITIES' credit rating is AA- (from KIS, NICE, and KKR). Issuance may be canceled if total subscriptions fall below KRW 1 billion.
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KOSPI Filing Information
- Filing: Shelf Registration Supplementary Document (Derivative-Linked Bonds - Equity-Linked Derivative-Linked Bonds)
- Company: DAISHIN SECURITIES (003540)
- Submission: DAISHIN SECURITIES CO.,LTD
- Receipt: 04-29-2026