ELB 1086th Series: Actual Issuance of 2 Billion Won Due to Under-Subscription

Daishin Securities issued the 1086th series of equity-linked derivative bonds (low risk): actual issuance amount 1.998 billion won vs. planned 4.995 billion won (subscription rate 40%), fully allocated due to under-subscription.
Underlying asset: Samsung Electronics common stock; maturity 365 days (April 28, 2027); unlisted securities.
Redemption conditions: 3.300% p.a. if underlying asset's maturity price is ≤500% of initial price, otherwise 3.290% p.a. (principal-protected low-risk structure).
Proceeds (approx. 2 billion won) to be used for hedging (underlying assets and derivatives); issuance cost 99,900 won (0.005% of issuance amount).
Subscription and allocation completed on April 28, 2026; minimum subscription amount 1 million won.

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