Hanmi Semiconductor Unveils New Market Plans in European IR

Hanmi Semiconductor holds a conference call IR for major European institutional investors sponsored by CLSA on May 12, 2026.
Entry into system semiconductor market: Launch of 2.5D package TC bonder (40·120) targeting foundry and OSAT.
Entry into HBF (High Bandwidth Flash) market: New concept TC bonder to meet AI semiconductor memory demand.
Entry into US AI semiconductor market: Participation in US-led AI semiconductor alliance to address AI package equipment demand.

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