Hanmi Semiconductor Participates in Macquarie Asia Conference, Announces AI Semiconductor Market Entry Plans
- • Hanmi Semiconductor participates in 'Macquarie Asia Conference 2026' in Hong Kong on May 18-20, 2026
- • Entry into AI system semiconductor (foundry, OSAT) market: plans to launch 2.5D Package TC bonder (40·120)
- • Entry into HBF (High Bandwidth Flash) market: new concept TC bonder to meet AI semiconductor memory demand
- • Entry into US-led AI semiconductor market: joining Big Tech, memory, foundry alliance to address AI package equipment demand
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KOSPI Filing Information
- Filing: Corporate Briefing (IR) Holding (Notice Disclosure)
- Company: HANMI Semiconductor (042700)
- Submission: HANMI Semiconductor
- Receipt: 05-15-2026
- Under KRX KOSPI Market Division