DAISHIN SECURITIES 1097th ELB Issuance of KRW 19.98 Billion, 181-Day Maturity, 3.10% Fixed Yield

DAISHIN SECURITIES publicly offers KRW 19.98 billion of equity-linked derivative bonds (low risk) linked to Samsung Electronics common stock.
Terms: face value KRW 10,000, issue price KRW 9,990, 2 million units, maturity November 26, 2026 (181 days), unlisted.
Redemption at maturity: if underlying asset reaches 300% of initial price, annual yield 3.11%; otherwise 3.10% (principal guaranteed).
Subscription period: only May 29, 2026, minimum subscription KRW 1 million, 100% subscription deposit required.
Issuer credit rating AA- (Korea Ratings, NICE, KIS, 2025-2026), not covered by depositor protection.
Early redemption: at least 95% of fair value (90% within first 6 months) but potential principal loss.
This issuance is debt financing with no dilution of shareholder equity.

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