Mirae Asset Securities to Issue KRW 24.875 Billion Equity-Linked Bonds (ELB) Linked to Samsung Electronics
- Mirae Asset Securities is publicly offering two series of Equity-Linked Bonds (ELB): 3977th (KRW 9.95 billion) and 3978th (KRW 14.925 billion), totaling KRW 24.875 billion, limited to Hana Bank trust clients.
- Underlying asset: Samsung Electronics common stock. Maturity: June 5, 2029 (approx. 3 years). Non-listed, not protected by the Depositor Protection Act.
- Series 3977 (Low Risk/Level 5): Auto-call at 70% of initial price (annual return 5.80%), principal protected at maturity if barrier breached (100% payment); max annual return 5.80%.
- Series 3978 (Low Risk/Level 5): Monthly coupon (0.495% if underlying closes at 60% or more of initial; annual 5.94%), auto-call at 75% (face value), principal protected at maturity (100% payment); max annual return 5.94%.
- Issue price: KRW 9,950 per note (face value KRW 10,000). Net proceeds approx. KRW 24.874 billion, to be used for hedging and other investments.
- Issuer credit rating AA (by KIS, NICE, KR), unsecured and unguaranteed, subject to issuer credit risk.
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KOSPI Filing Information
- Filing: Shelf Registration Supplementary Document (Derivative-Linked Bonds - Equity-Linked Derivative-Linked Bonds)
- Company: Mirae Asset Securities (006800)
- Submission: Mirae Asset Securities Co., Ltd.
- Receipt: 05-21-2026