Daishin Securities Issues KRW 29.9 Billion Equity-Linked Bond (3.2% p.a., 1-Year Maturity)
- Daishin Securities issues the 1098th series Equity-Linked Bond (ELB) worth KRW 29.9 billion (3,000,000 units, issue price per unit: KRW 9,970) via subscription on June 1, 2026.
- Underlying asset is Samsung Electronics common stock; if the underlying price remains at or below 500% of the initial reference price at maturity (June 1, 2027), annual return of 3.20%, otherwise 3.19%.
- This security is not protected under the Depositor Protection Act; it is unlisted and may incur principal loss upon early redemption.
- Proceeds will be used for hedging the underlying asset and investing in financial instruments.
- Issuance may be cancelled if total subscription amount is less than KRW 1 billion.
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KOSPI Filing Information
- Filing: Shelf Registration Supplementary Document (Derivative-Linked Bonds - Equity-Linked Derivative-Linked Bonds)
- Company: DAISHIN SECURITIES (003540)
- Submission: DAISHIN SECURITIES CO.,LTD
- Receipt: 05-21-2026