Daishin Securities 1092nd Equity-Linked Bond (Low Risk) Issuance Filing
- Daishin Securities issued the 1092nd Equity-Linked Bond (Low Risk) linked to Samsung Electronics common stock, with total offering of KRW 4,997.5 billion (face value KRW 10,000, issue price KRW 9,995). Maturity 184 days (Nov 6, 2026), yield 3.19%~3.20% p.a. (3.20% if underlying ≤ 500% of initial price, else 3.19%).
- This bond is not covered by deposit insurance, carries issuer credit risk (Daishin credit rating AA- from KIS, KR, NICE), is unlisted on exchanges (limited liquidity), and may incur principal loss upon early redemption.
- Daishin's 2026 shelf registration allows up to KRW 20 trillion in issuance; KRW 1.15 trillion issued so far, with KRW 16.87 trillion remaining.
- Recent disclosures (last 6 months) for underlying Samsung Electronics include cash dividend decisions and share buyback/disposal/cancellation actions, reflecting shareholder return policies.
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KOSPI Filing Information
- Filing: Shelf Registration Supplementary Document (Derivative-Linked Bonds - Equity-Linked Derivative-Linked Bonds)
- Company: DAISHIN SECURITIES (003540)
- Submission: DAISHIN SECURITIES CO.,LTD
- Receipt: 05-04-2026