Issuance of 4 equity-linked bonds linked to Samsung Electronics and NAVER worth 109.4 billion won
- Decision to issue 4 equity-linked bonds (ELB series 1073-1076) totaling 109.45 billion won, underlying Samsung Electronics common stock (1073-1075) and NAVER common stock (1076), maturity May 16, 2029
- Series 1073: 80% barrier auto-call, 5.90% p.a. coupon (pre-tax), principal protected (principal paid if below 80% at maturity), offering amount 19.9 billion won
- Series 1074: Monthly coupon 0.4375% (5.25% p.a.), 80% barrier auto-call, principal protected, offering amount 29.85 billion won
- Series 1075: Monthly coupon 0.49% (5.88% p.a.), 85% barrier auto-call, principal protected, offering amount 39.8 billion won
- Series 1076: Monthly coupon 0.455% (5.46% p.a.), 85% barrier auto-call, principal protected, underlying NAVER, offering amount 19.9 billion won
- Issue price 9,950 won per bond (face value 10,000 won), subscription period only on May 13, 2026, limited to Hana Bank trust department
- All bonds unlisted, not covered by depositor protection, credit risk from issuer rating AA- (NICE)
- Under shelf registration, total planned 2.5 trillion won, actual issued 2.312 trillion won, remaining 187.7 billion won
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KOSPI Filing Information
- Filing: Shelf Registration Supplementary Document (Derivative-Linked Bonds - Equity-Linked Derivative-Linked Bonds)
- Company: Hanwha Investment & Securities (003530)
- Submission: Hanwha Investment & Securities Co., Ltd.
- Receipt: 04-29-2026