Mirae Asset Securities Issues KRW 19.9 Billion Series 3970 Equity-Linked ELB Linked to Samsung Electronics
- Mirae Asset Securities issues Series 3970 Equity-Linked Derivative Bond (ELB) linked to Samsung Electronics common stock, totaling KRW 19.9 billion (issue price: KRW 9,950 per security, 2,000,000 securities, maturity May 16, 2029)
- Monthly coupon condition: if Samsung Electronics closing price on each monthly evaluation date is at least 65% of the initial reference price, pay 0.4375% monthly (5.25% p.a.); otherwise no coupon
- Autocall condition: evaluated semi-annually; if closing price is at least 80% of initial reference price, redeem at 100% of face value (principal); up to 5 autocall opportunities
- Maturity redemption: regardless of underlying asset price, pay 100% of face value (principal guaranteed) → no principal loss
- Minimum subscription: if total subscription amount is less than KRW 497.5 million, issuance may be cancelled; non-listed, not protected by depositor protection act
- Issuer credit rating: AA (from Korea Ratings, NICE, and Korea Corporate Rating, as of April 2026)
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KOSPI Filing Information
- Filing: Shelf Registration Supplementary Document (Derivative-Linked Bonds - Equity-Linked Derivative-Linked Bonds)
- Company: Mirae Asset Securities (006800)
- Submission: Mirae Asset Securities Co., Ltd.
- Receipt: 04-29-2026