Equity-Linked Bond Issuance Results (Series 1078·1079): Subscription Rates 62% and 33%

Issuance results for Series 1078 (183-day) and 1079 (365-day) equity-linked bonds (low risk, underlying Samsung Electronics)
Series 1078: actual proceeds 18.68 billion won vs. planned 29.97 billion won (subscription rate 62.3%)
Series 1079: actual proceeds 9.72 billion won vs. planned 29.94 billion won (subscription rate 32.5%)
Redemption: if underlying ≤500% of initial price, principal + annual 3.1%~3.2%; otherwise 3.09%~3.19%
Almost all (99.9%) of proceeds to be used for hedging; issuance costs 0.005% of total

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